AlN ceramic substrate sheet
Alias: Insulating aluminum nitride (AlN) ceramic heat dissipation substrate
Description：
Ceramic substrate sheet made of aluminum nitride (AlN) material, also known as Insulating aluminum nitride (AlN) ceramic heat dissipation substrate. It can efficiently conduct heat quickly from heat sources, such as semiconductor devices, and dissipate heat to the surrounding environment through the substrate sheet, thereby improving the operational efficiency and stability of the device. This material is mainly used as: insulating substrates for high-power semiconductor devices, heat dissipation substrates for large-scale and ultra-large-scale integrated circuits, separator materials inside lithium batteries, cutting tools, packaging materials and heat dissipation plates, etc., especially suitable for high-performance computing equipment, power semiconductors and LED lighting equipment, among which heat dissipation needs are particularly critical.
Features:
Aluminum nitride substrate sheets, also known as Insulating aluminum nitride (AlN) ceramic heat dissipation substrate sheets, leverage the high thermal conductivity and electrical insulation properties of aluminum nitride (AlN) to provide efficient cooling solutions for electronic devices:
1. High thermal conductivity
Aluminum nitride has a thermal conductivity of up to 170 W/m·K, which allows it to quickly absorb and conduct heat from heat sources (such as semiconductor devices), effectively dissipating heat into the environment through the large surface area of the substrate sheet.
2. Excellent electrical insulation
With an electrical breakdown strength of up to 17-19 KV/mm and low dielectric losses, aluminum nitride substrates provide excellent thermal management capabilities without compromising their electrical insulation.
3. Low coefficient of thermal expansion
Its coefficient of thermal expansion is 3.2-3.4×10-6/℃, which is close to silicon, which makes it have excellent compatibility with semiconductor materials when the temperature changes, and reduces the stress caused by the difference in thermal expansion.
4. Good thermal stability
It can be used in aerobic environments up to 1000℃ and has good thermal shock stability (ΔT400℃), making it suitable for operating environments at high temperatures.
5. Smooth surface and Uniform thickness
This helps improve thermal contact efficiency and reduce thermal resistance, thereby enhancing heat dissipation performance.
Applications:
Aluminum nitride substrates play a crucial role in many high-tech sectors, especially in applications requiring efficient heat dissipation:
1. High-performance computing equipment
Such as servers and workstations, these devices generate a lot of heat and need to dissipate heat efficiently to maintain stable and efficient operation.
2. Power semiconductors and power electronics
Including drive systems for frequency converters and electric vehicles, the heat generated by power elements in these systems needs to be controlled through efficient thermal management.
3. LED lighting equipment
LED components generate higher heat, and using aluminum nitride substrates can extend the lifespan of LEDs and maintain light efficiency.
4. Electronic packaging
Aluminum nitride substrate sheets are also widely used in semiconductor packaging to help reduce heat buildup inside the package and improve overall device performance and reliability.
Aluminum nitride substrate sheets play a pivotal role in modern electronics manufacturing through their exceptional thermal conductivity and electrical insulation, particularly in high-temperature, high-power applications. These substrate sheets not only effectively improve the operational efficiency and stability of the equipment, but also greatly extend the service life of the equipment through optimized thermal management. Its high performance and reliability make aluminum nitride substrates ideal for cooling electronic devices, meeting the growing heat dissipation needs of high-performance electronic devices.
Product customization:
1. Surface finish: The surface finish of aluminum nitride ceramics can reach Ra≤0.1μm after polishing.
2. The dimensional accuracy of the product in all directions is guaranteed by laser scribing, and the minimum value ± 0.10mm.
3. Special specification products can be customized according to customer requirements.
In the field of precision ceramic processing and customization, Fudong Machinery is committed to the production of various high-performance ceramic parts, including zirconia ceramics, silicon nitride, aluminum nitride and other products. These ceramic parts have excellent thermal stability, electrical insulation, high temperature stability and wear resistance, and are widely used in key fields such as aerospace, electronics, machinery, military industry, and automotive.
With its excellent performance and reliability, our products provide customers with key support and guarantees, helping them improve production efficiency and optimize product performance.
Non-standard parts customization, due to different requirements such as product size, material details, processing accuracy, etc., resulting in different costs such as material costs, processing costs, packaging logistics, etc. Please be sure to contact customer service when ordering, provide as much part information (drawings or samples, use environment, etc.) and your requirements (quantity, delivery date, etc.) as much as possible, and we will submit you a specific plan that meets your parts requirements, as well as a preferential quotation. Thank you very much for your interest!
