Alumina ceramic heat-sink sheets Alias: Ceramic substrate sheet or patch
Description：
Heat-sink sheets made of alumina (Al2O3) ceramics are often referred to as ceramic substrates or patches in the electronics industry. It is mainly used to improve the heat dissipation efficiency of semiconductor devices, such as in LED lighting systems, power transistors, and microprocessors. These substrates or patches can effectively absorb heat from active electronic components and quickly dissipate heat to the surrounding environment, thereby preventing overheating of the device and ensuring stable operation and extended service life of electronic devices.
Features:
Alumina ceramic heat-sink sheets, also known as ceramic substrates or patches, are efficient thermal management solutions, particularly suitable for high-performance electronic devices. Key features of these heatsinks include:
— High thermal conductivity
The thermal conductivity of alumina ceramics is as high as 27.5 W/(m·k), allowing them to quickly absorb and dissipate heat from electronic components, effectively reducing the problem of overheating of devices.
— Excellent electrical insulation
It has a high electrical breakdown strength of over 10 KV/mm and low dielectric loss, ensuring efficient heat conduction while electrically insulating.
— Mechanical stability
With a compressive strength of up to 2000 MPa and a Vickers hardness of 15.7 GPA, it guarantees durability and stability under physical stress.
— Thermal stability and thermal shock resistance
The maximum operating temperature can reach 1650℃, and it has good thermal shock stability, making it suitable for use in high-temperature environments.
— Custom Design
The heat-sink sheets are typically rectangular or square in shape and can be customized in size and thickness to meet specific assembly and performance requirements based on application needs.
Applications:
Alumina ceramic heat-sink sheets are used in a wide range of applications in the electronics manufacturing industry, with key applications including:
1. LED lighting system
Used in LED components to optimize thermal management, extend LED lifespan, and maintain light efficiency.
2. Power semiconductors
It is used to handle the heat load of high-power transistors and microprocessors, improving the performance and reliability of the device.
3. High-performance computing
In high-speed computers and servers, heatsinks help manage heat generated due to large amounts of data processing.
4. Communication equipment
In wireless and network communication equipment, heat sinks prevent overheating, ensuring continuous operation and signal stability of communication equipment.
Alumina ceramic heat sinks play a crucial role in modern electronic devices through their excellent thermal conductivity, electrical insulation, and mechanical stability. These heat sinks not only effectively manage the heat load on sensitive electronic components but also enhance the overall operational efficiency and reliability of the equipment. Its high-performance physical and thermal properties make it an ideal choice for ensuring the stable operation of electronic devices in demanding environments.
With custom designs, alumina ceramic heat sinks meet the demands of various high-performance electronic applications, making them indispensable and critical components in the electronics manufacturing industry.
In the field of precision ceramic processing and customization, Fudong Machinery is committed to the production of various high-performance ceramic parts, including zirconia ceramics, silicon nitride, aluminum nitride and other products. These ceramic parts have excellent thermal stability, electrical insulation, high temperature stability and wear resistance, and are widely used in key fields such as aerospace, electronics, machinery, military industry, and automotive.
With its excellent performance and reliability, our products provide customers with key support and guarantees, helping them improve production efficiency and optimize product performance.
